Electroless plating nickel particles on hexagonal boron nitride (h-BN) of ceramic powders are investigated in this paper. As comparison, the different additive concentration of choline chloride-ethylene glycol (ChCl-EG) ionic liquid (0g/L, 30g/L, 60g/L, 90g/L) is presented. The effects of ChCl-EG concentration are studied, including the surface morphologies, phase analysis of Ni-decorated h-BN powders, and the residual Ni2+ concentration is measured in electroless plating bath. It is demonstrated that the deposition phenomena of nickel particles on h-BN surface is changed with the addition of ChCl-EG. When the concentration of ChCl-EG is 30g/L, the Ni particles on h-BN surface are in dispersed and spheroid state with the average size of 10-1000nm. It can be found that 30g/L ChCl-EG is conducive to the arise of deposition phenomena, which is the formation of the single nickel particle on h-BN surface. Besides, more Ni particles are deposited on h-BN surface with the increase of plating nickel times, which is characterized with scanning electron microscope (SEM) and transmission electron microscope (TEM). Furthermore, the deposition phenomenon and growth mechanism are proposed without and with ChCl-EG as additive to further elaborate the formation of Ni particles on h-BN surface.